eInfochips Boosts Qualcomm's Robotics Accelerator Program Powered by Techstars With Eragon SoMs and Services

eInfochips Eragon Product Line Comprising of Development Kit, System-on-Module and its Design Services will be Leveraged by the Robotics Accelerator Participants to Kick Start their Robotics Applications

eInfochips (http://www.einfochips.com) is working with Qualcomm Incorporated and Techstars to engage with Qualcomm Robotics Accelerator powered by Techstars participants to bring their innovative ideas to life. Qualcomm has selected 10 robotics companies that will be participating in the four-month mentorship-driven startup program to focus on building the next generation of robots and intelligent machines. eInfochips' team is providing support and resources to the accelerated companies to help build the next generation of intelligent machines.


Robots are no longer just the business of research laboratories and secretive corporate divisions. With emerging innovative technologies, the next generation robots will soon surprise us by enabling Robots to do things that people thought were impossible. The support for Robot Operating System (ROS) on Qualcomm Snapdragon processors will enable functionalities such as interpretation, machine learning, artificial intelligence, facial and gesture recognition, voice command operation etc. These platforms aim to provide an integrated, low power solution for multiple robotics applications and will extend the processors applicability for diverse selection of products, from drones to toys and to home appliances. Qualcomm Snapdragon is a product of Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated.

"We are excited to see what this new batch of companies will achieve with help from eInfochips especially given their deep expertise in Snapdragon platforms and their sophisticated engineering capabilities," said Charles Bergan, Vice president of engineering for Qualcomm Technologies, Inc.

eInfochips has strong expertise in system software along with Snapdragon processors and has developed proof of concepts and demo applications for robotics. In addition to the engineering support services for the Robotics Accelerator companies, eInfochips also has to offer Eragon product line comprising of system on modules, development kits based on Snapdragon 600 and 410 processors. The latest Eragon 410 is an ultra-small (35mm x 26mm) System on Module (SoM) with low power consumption and superior multimedia experience and processing capability makes it an ideal building block for robotics application.

Parag Mehta, Chief Marketing and Business Development Officer at eInfochips said, "We are excited to be part of the Robotics Accelerator and are helping the start-ups in development by providing development kits and design services. eInfochips along with Qualcomm will play a critical role in driving this innovation forward."

About eInfochips
eInfochips provides product design and software services. With over two decades of experience, eInfochips has helped customers design over 500+ products that are deployed across 130 countries. eInfochips SoMs and design services are made available globally in Asia, North America and Europe. eInfochips is a global product innovation partner, recognized for technology leadership by Gartner, Frost & Sullivan, NASSCOM and Zinnov.

Visit us at http://www.einfochips.com, or stay connected on LinkedIn, Facebook, SlideShare, Twitter and YouTube.

To request information, contact marketing@einfochips.com

Featured Product

3D Vision: Ensenso B now also available as a mono version!

3D Vision: Ensenso B now also available as a mono version!

This compact 3D camera series combines a very short working distance, a large field of view and a high depth of field - perfect for bin picking applications. With its ability to capture multiple objects over a large area, it can help robots empty containers more efficiently. Now available from IDS Imaging Development Systems. In the color version of the Ensenso B, the stereo system is equipped with two RGB image sensors. This saves additional sensors and reduces installation space and hardware costs. Now, you can also choose your model to be equipped with two 5 MP mono sensors, achieving impressively high spatial precision. With enhanced sharpness and accuracy, you can tackle applications where absolute precision is essential. The great strength of the Ensenso B lies in the very precise detection of objects at close range. It offers a wide field of view and an impressively high depth of field. This means that the area in which an object is in focus is unusually large. At a distance of 30 centimetres between the camera and the object, the Z-accuracy is approx. 0.1 millimetres. The maximum working distance is 2 meters. This 3D camera series complies with protection class IP65/67 and is ideal for use in industrial environments.