Aetina Launches Industrial MXM Powered by NVIDIA Blackwell Platform, Empowering AMR, Manufacturing and Medical AI

Designed for autonomous robotics, manufacturing equipment, and medical devices, the new modules provide industrial-grade reliability and next-generation AI computing efficiency at the edge.

Students and Educators Set To Explore the Power of Technology and Innovation at IMTS 2026

Hands-On Experiences and Career Pathways Return To Inspire the Next Generation

Roboteon Announces Powerful, Certified Warehouse Automation Solution for Microsoft Dynamics 365

Roboteon Fulfillment and Orchestration Platform now has Pre-Built Integration with D365, and Delivers an Array of Benefits for Robotics Deployments in Distribution and Manufacturing

DJI Redefines Aerial Delivery with DJI FlyCart 100

Achieve More Delivery with DJI's Next-Generation Delivery Drone, Carrying Up to 100 kg with Longer Flight Distance and Improved Power Efficiency.

Future Labs: Autonomous Inc. Expands into AI Hardware and Robotics.

XELA Robotics Announces Integration Milestone and Reveals its 2026 Technology Roadmap

Company to exhibit and demonstrate its technology at 2026 Consumer Electronics Show in Las Vegas

XELA Robotics Announces Integration Milestone and Reveals its 2026 Technology Roadmap

Company to exhibit and demonstrate its technology at 2026 Consumer Electronics Show in Las Vegas

Humanoids Summit Returns to Silicon Valley

Global Showcase of Cutting-Edge Humanoid Robotics and Physical AI, Featuring Dozens of Exhibits and the Industry's Leading Voices

Pudu Robotics Unveils PUDU D5 Series: Industry-Grade Autonomous Quadruped Robots Designed for Complex, Real-World Operations

The series includes two configurations: the PUDU D5, a legged version built for maximum terrain adaptability, and the PUDU D5-W, a wheeled version designed for optimized performance on mixed surfaces.

High-Speed Automated Alignment for Optics and Photonics: PI Introduces Next-Generation 6-Axis Nanopositioning Alignment System

6-DOF motion, ultra-compact footprint, and high-speed photonics alignment algorithms integrated directly into the controller firmware.

Voyant Photonics expands Carbon™ FMCW LiDAR Platform with new product extension, unlocking chip-scale sensing to new markets

The new models, which will be on display at the upcoming CES 2026 event (visit Voyant Photonics at the LVCC West Hall in Booth #4875) complement the existing 128-line configurations, enabling broader choices and customizations from the Voyant portfolio of low-cost, high-performance sensors, and optimized for industrial autonomy, robotics, drones, and smart infrastructure applications.

Realtime Robotics to Debut Resolver for the Japanese Market at iREX 2025

Visit iREX Booth W4-61 to Experience the Interactive Resolver Demo and See the Latest Product Enhancements

igus® Develops One-Piece, Space-Saving Energy Chain for Compact Applications

Designers often skip cable guides in small installations — such as in food vending machines, laboratory equipment or electric doors — risking cable damage and increasing maintenance costs. This new, compact energy chain is engineered to close that gap.

Explore the Evolution of Robotics to Autonomy in New eBook from Mouser Electronics and onsemi

In Engineering the Future: The Sensors and Systems Powering Modern Mobile Robots, engineers from onsemi and experts from across the industry discuss the impact of autonomous mobile robots (AMRs), the transformative potential of physical AI, and how engineers can develop solutions that are efficient, high-performing, and scalable.

Daimler Truck and Torc Robotics Select Innoviz Technologies as LiDAR Partner for Series Production of Level 4 Autonomous Trucks

InnovizTwo High-Performance Short-Range LiDAR to enable SAE (Society of Automotive Engineers) Level 4 autonomous capabilities for commercial trucks deployment

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Featured Product

3D Vision: Ensenso B now also available as a mono version!

3D Vision: Ensenso B now also available as a mono version!

This compact 3D camera series combines a very short working distance, a large field of view and a high depth of field - perfect for bin picking applications. With its ability to capture multiple objects over a large area, it can help robots empty containers more efficiently. Now available from IDS Imaging Development Systems. In the color version of the Ensenso B, the stereo system is equipped with two RGB image sensors. This saves additional sensors and reduces installation space and hardware costs. Now, you can also choose your model to be equipped with two 5 MP mono sensors, achieving impressively high spatial precision. With enhanced sharpness and accuracy, you can tackle applications where absolute precision is essential. The great strength of the Ensenso B lies in the very precise detection of objects at close range. It offers a wide field of view and an impressively high depth of field. This means that the area in which an object is in focus is unusually large. At a distance of 30 centimetres between the camera and the object, the Z-accuracy is approx. 0.1 millimetres. The maximum working distance is 2 meters. This 3D camera series complies with protection class IP65/67 and is ideal for use in industrial environments.

Robotics and Automation - Featured Company

DESTACO

DESTACO

DESTACO is now the worldwide leader in the innovation, design, manufacture and support of clamping, gripping, transferring, indexing and robotic tooling solutions for workplace and automation needs.