IMTS 2014 - Midwest Engineering Systems Exhibiting at IMTS with KUKA Robotics
Midwest Engineering Systems an official KUKA Robotics System Partner will be featured in the Kuka Robotics Corporation booth and display new automation technology.
OpenFPV
From Tilman Griesel's posts on DIY Drones:
Open source project to make FPV(first person view) with the raspberry pi easy to use for every one.
OpenFPV is a project that uses latest technology to provide low latency, easy and well tested open source FPV flying. Based on single-board computers, HD cameras and IEEE 802.11.
Current Features:
Recording
Web interface
Low-Latency H264 Streaming (≈120ms)
RESTful API
Customizable
Extendable
Installer (in progress)
Minimal bettery consumption
Roadmap:
Invite more people to join the development team
Complete the installer
More field tests with different setups
Create desktop applications for mac/win with HUD support
Add OculusVR support
Release is not available yet but you can follow the progress on DIY Drones or the OpenFPV homepage .
VDK6000 Robotic Cell for Metal 3D Printing and Metal Part Refurbishing
Flexible Robotics Environment, (FRE) announces the creation of VDK6000 robotic metal 3D printing and repair work cell that automates refurbishing, rebuilding and/or creation of metal components utilizing subtractive and additive technology.
PaR Systems Revolutionizing Friction Stir Welding Process with I-RoboSTIR Solution
PaR Systems, Inc., a world leader in aerospace manufacturing, material handling, automation, and robotic solutions since 1961, announced today that its Shoreview based Automation Solutions Business and its I-STIR Technology, in partnership with FANUC America, are revolutionizing the utilization of the Friction Stir Welding process.
Cadence Announces Protium Rapid Prototyping Platform and Expands System Development Suite Low-Power Verification
Protium rapid prototyping platform features flow compatibility with Palladium platform, shortening bring-up time by up to 70 percent versus competitive solutions
----New Protium rapid prototyping platform increases capacity by 4X over the previous generation
---- Palladium XP II verification computing platform now features IEEE 1801 support for improved low-power verification
Sierra-Olympic Introduces Continuous Zoom, Uncooled LWIR Thermal Chassis Camera
The Vinden CZ series is designed as an open-frame chassis camera for integrators and OEMs in industrial, security/surveillance, and military markets.
Klein® Tools Introduces the Switch Drive System
Switch from a handle to a drill in a snap!
New Makers in Store for Fifth Year of Maker Faire Detroit July 26-27 at The Henry Ford
More than 100 new makers to take over Henry Ford Museum for two days of unbridled creativity and fun.
Klein® Tools Adds New Demolition Driver Models
Engineered, manufactured and tested for prying, chiseling and punching.
New Automated Bulk Bag Filling System Streamlines Peanut Processing
The new Spiroflow Systems gain-in-weight bulk bag filling system delivers 15x productivity increase, increases weighing accuracy over 400%, reduces number of operators from nine to one and minimizes possible product contamination.
Park NX-Wafer for Wafer-Fab Manufacturing Fully Automates Semiconductor Industry's Bare Wafer Automated Defect Review Process, Increases Throughput by 1,000 Percent
Park Systems, a leading manufacturer of atomic force microscopy (AFM) products announces Park NX-Wafer, a revolutionary AFM design for bare wafer manufacturing that fully automates the defect review process and increases production throughput by an astounding 1,000%. Park NX-Wafer produces sub-Angstrom roughness measurements for the flattest substrates and wafers with tip-to-tip variation of less than 2%, for the first time ever in the entire history of the semiconductor industry.
Bruker Introduces Inspire Nanoscale Chemical Mapping System
System features new PeakForce IR SPM Mode for Comprehensive Nanocharacterization
STRATASYS COMPLETES ACQUISITION OF SOLID CONCEPTS
Stratasys expects to complete its acquisition of Harvest Technologies by the end of July.
Parallella: $119 Parallel Computing Platform with 16-core Epiphany chip
Parallella Computer Specifications:
The Parallella platform is an open source, energy efficient, high performance, credit-card sized computer based on the Epiphany multicore chips developed by Adapteva. This affordable platform is designed for developing and implementing high performance, parallel processing applications developed to take advantage of the on-board Epiphany chip. The Epiphany 16 or 64 core chips consists of a scalable array of simple RISC processors programmable in C/C++ connected together with a fast on chip network within a single shared memory architecture... ( cont'd )
A realtime raytracing example running on the 16-core Epiphany chip:
Allied Market Research: 3D Printing Market is Expected to Reach $8.6 Billion, Globally, by 2020
The global 3D printing market will reach $8.6 billion by 2020, registering a CAGR of 20.6% from 2014 to 2020.
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Mobile Robots - Featured Product
ElectroCraft's Motion Control for Mobile Robots
ElectroCraft is showcasing its award-winning mobile robot technology including their powerful and compact wheel drives, high-torque-density brushless DC motors, precision linear actuators as well as servo motor drive technology at a variety of conferences and tradeshows including the Boston Robotics Summit. Robotics Summit is the premier symposium for the sharing of ideas, technology, and market developments for robotic technologies across industries. Beyond a showcase and pitch of product, ElectroCraft is eager to participate in the collaborative discussion of challenges and opportunities that will shape the near and long-term robotic marketplace.
