2D cameras for positioning and inspecting ultra-fine wires in semiconductor production
Wire bonding is a key process in semiconductor production. Extremely fine wires with diameters of 15 to 75 micrometers are used to create tiny electrical connections between a semiconductor chip and other components.
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Featured Product
Palladyne IQ - Unlocking new frontiers for robotic performance.
Palladyne IQ is a closed-loop autonomy software that uses artificial intelligence (AI) and machine learning (ML) technologies to provide human-like reasoning capabilities for industrial robots and collaborative robots (cobots). By enabling robots to perceive variations or changes in the real-world environment and adapt to them dynamically, Palladyne IQ helps make robots smarter today and ready to handle jobs that have historically been too complex to automate.
Robotics and Automation - Featured Company
PI USA (Physik Instrumente)
PI is a privately held company that designs and manufactures world-class precision motion and automation systems including air bearings, hexapods and piezo drives at locations in North America, Europe, and Asia. The company was founded 5 decades ago and today employs more than 1700 people worldwide. PI's customers are leaders in high-tech industries and research institutes in fields such as photonics, life-sciences, semiconductors and aerospace.
