Semiconductor Innovations for the Next Generation of Robots
Each motor requires high power density and precise control, all packed into a small form factor. TI's technology reduces the size of the board by integrating FETs, drivers and current sensing into one package.
2D cameras for positioning and inspecting ultra-fine wires in semiconductor production
Wire bonding is a key process in semiconductor production. Extremely fine wires with diameters of 15 to 75 micrometers are used to create tiny electrical connections between a semiconductor chip and other components.
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Featured Product
KNF - Automation Technology Requires Reliable and Durable Pumps
KNF vacuum pumps for automation applications are designed for a long service life, with micro gas pumps used as cobot pumps achieving more than 20,000 hours. The latest generation of KNF brushless DC motors has an innovative bearing design that withstands high mechanical loads. This technical strength protects the vacuum pump's longevity, especially with fast switching cycles.
Robotics and Automation - Featured Company
Zimmer Group US, Inc.
Are you interested in premium products in the fields of mechanical and plant engineering? Do you want to learn more about our solutions in the fields of automation, damping, linear, processing, tooling, and machine tooling technology?
