2D cameras for positioning and inspecting ultra-fine wires in semiconductor production
Wire bonding is a key process in semiconductor production. Extremely fine wires with diameters of 15 to 75 micrometers are used to create tiny electrical connections between a semiconductor chip and other components.
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Featured Product
Boston Dynamics Webinar - Why Humanoids Are the Future of Manufacturing
Join us November 18th for this Webinar as we reflect on what we've learned by observing factory floors, and why we've grown convinced that chasing generalization in manipulation—both in hardware and behavior—isn't just interesting, but necessary. We'll discuss AI research threads we're exploring at Boston Dynamics to push this mission forward, and highlight opportunities our field should collectively invest more in to turn the humanoid vision, and the reinvention of manufacturing, into a practical, economically viable product.
Robotics and Automation - Featured Company
CMES Robotics Inc.
Powered by AI, CMES Robotics enables 3D vision for factory robots. CMES AI vision software enables robots to recognize unstructured, flexible, or deformed objects, pick them up, and loading and unloading. CMES Vision software has been deployed worldwide for random palletization and depalletization along with void filling applications. CMES Robotics automates your warehouse, logistics, and supply chain.
