2D cameras for positioning and inspecting ultra-fine wires in semiconductor production
Wire bonding is a key process in semiconductor production. Extremely fine wires with diameters of 15 to 75 micrometers are used to create tiny electrical connections between a semiconductor chip and other components.
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igus® - Free heavy-duty plastic bearings sample box
The iglide® heavy-duty sample box provides a selection of five unique iglide bearings, each suitable for use in heavy-duty equipment due to their self-lubricating, dirt-resistant properties. Each bearing material boasts unique benefits and is best suited for different application conditions, though each can withstand surface pressures of at least 11,603 psi at 68°F.
