2D cameras for positioning and inspecting ultra-fine wires in semiconductor production
Wire bonding is a key process in semiconductor production. Extremely fine wires with diameters of 15 to 75 micrometers are used to create tiny electrical connections between a semiconductor chip and other components.
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Featured Product
TM Robotics - Shibaura Machine THE SCARA range
The THE range from Shibaura Machine is an extensive line up of SCARA robots. Available in four arm lengths THE400 (400mm), THE600 (600mm) and the most recent THE800 (800mm) and THE1000 (1000mm), this range is suitable for assembly, handling, inspection and pick and place processes in varied industrial applications. The THE1000 boasts a 20kg payload capacity and an impressive 0.44 second cycle time, providing high speeds for processes with large components. In fact, the range has been recognised for as the price-to-performance leader compared to other SCARA models in its price range due to its impressive speed versus payload capacity.
