2D cameras for positioning and inspecting ultra-fine wires in semiconductor production
Wire bonding is a key process in semiconductor production. Extremely fine wires with diameters of 15 to 75 micrometers are used to create tiny electrical connections between a semiconductor chip and other components.
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CMES - AI-Powered 3D Robot Vision
Powered by AI, CMES Robotics enables 3D vision for factory robots. CMES AI vision software enables robots to recognize unstructured, flexible, or deformed objects, pick them up, and loading and unloading. CMES Vision software has been deployed worldwide for random palletization and depalletization along with void filling applications. CMES Robotics automates your warehouse, logistics, and supply chain. For more information, please visit: cmesrobotics.com or email info@cmesrobotics.com.
