2D cameras for positioning and inspecting ultra-fine wires in semiconductor production
Wire bonding is a key process in semiconductor production. Extremely fine wires with diameters of 15 to 75 micrometers are used to create tiny electrical connections between a semiconductor chip and other components.
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Featured Product
Zimmer Group - THE PREMIUM GRIPPER NOW WITH IO-LINK
IO-Link is the first standardized IO technology worldwide for communication from the control system to the lowest level of automation.
Robotics and Automation - Featured Company
Electrocraft Inc.
ElectroCraft, Inc. is a global provider of dependable, application-engineered fractional-horsepower motor and motion products. Our products are found in thousands of different applications within industrial, commercial, and consumer product markets. While ElectroCraft provides a wide array of standard products with many configurable options, we have built our brand on custom OEM solutions that meet the precise performance, cost and quality our customers require.
