2D cameras for positioning and inspecting ultra-fine wires in semiconductor production
Wire bonding is a key process in semiconductor production. Extremely fine wires with diameters of 15 to 75 micrometers are used to create tiny electrical connections between a semiconductor chip and other components.
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Featured Product
3MP HDR IP69K Camera for Robotics & Autonomous Vehicles
STURDeCAM31 from e-con Systems® is designed to make robotics and autonomous vehicles safer and more reliable. Powered by the Sony® ISX031 sensor and featuring GMSL2 interface, this compact 3MP camera delivers 120dB HDR + LFM imaging with zero motion blur — even in the most challenging outdoor conditions. Engineered to automotive-grade standards, STURDeCAM31 is IP69K certified, making it resistant to dust, water, vibration, and extreme temperatures. With support for up to 8 synchronized cameras, it enables powerful surround-view and bird's eye systems on NVIDIA® Jetson AGX Orin™.
Robotics and Automation - Featured Company
Boston Dynamics
Boston Dynamics is the global leader in developing and deploying highly mobile robots capable of tackling industry's toughest challenges.
