2D cameras for positioning and inspecting ultra-fine wires in semiconductor production
Wire bonding is a key process in semiconductor production. Extremely fine wires with diameters of 15 to 75 micrometers are used to create tiny electrical connections between a semiconductor chip and other components.
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Featured Product
Robotmaster 2024
Program multi-robot cells and automatically solve robotic errors with ease. Hypertherm Associates announces a new version to its robotic programming software. Robotmaster 2024 addresses key market trends including the support for programming multiple robots in a single work cell and the demand for automatic trajectory optimization and robotic error correction.
Robotics and Automation - Featured Company
Boston Dynamics
Boston Dynamics is the global leader in developing and deploying highly mobile robots capable of tackling industry's toughest challenges.
