2D cameras for positioning and inspecting ultra-fine wires in semiconductor production
Wire bonding is a key process in semiconductor production. Extremely fine wires with diameters of 15 to 75 micrometers are used to create tiny electrical connections between a semiconductor chip and other components.
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Featured Product
igus - triflex R robot dresspacks
Properly managed cables on a multi-axis robot are the difference between successful, failure-free operation and frequent unplanned downtime and lost profits. Discover how triflex® robot dresspacks are designed to protect cables in multi-axis motion - extending cable life, minimizing costs, and reducing unplanned downtime.
Robotics and Automation - Featured Company
CMES Robotics Inc.
Powered by AI, CMES Robotics enables 3D vision for factory robots. CMES AI vision software enables robots to recognize unstructured, flexible, or deformed objects, pick them up, and loading and unloading. CMES Vision software has been deployed worldwide for random palletization and depalletization along with void filling applications. CMES Robotics automates your warehouse, logistics, and supply chain.
