2D cameras for positioning and inspecting ultra-fine wires in semiconductor production
Wire bonding is a key process in semiconductor production. Extremely fine wires with diameters of 15 to 75 micrometers are used to create tiny electrical connections between a semiconductor chip and other components.
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Featured Product
MVTec MERLIC 5.8
With MERLIC 5.8, MVTec expands its easy-to-use machine vision software. The latest version improves process reliability beyond pure image processing, offering enhanced error handling and optimized configuration. This enables faster setup and stable deployment across diverse production environments. Explore MERLIC 5.8 now
Robotics and Automation - Featured Company
Onward Robotics
Onward Robotics delivers innovative automation technology that coordinates humans and robots as a cohesive system to revolutionize fulfillment. Our Meet Me® solution combines proprietary software with person-to-goods mobile robots to increase efficiency in warehousing, distribution, and e-commerce operations. Onward Robotics provides the boost in productivity, flexibility, and speed that companies need to remain competitive and grow.
