2D cameras for positioning and inspecting ultra-fine wires in semiconductor production
Wire bonding is a key process in semiconductor production. Extremely fine wires with diameters of 15 to 75 micrometers are used to create tiny electrical connections between a semiconductor chip and other components.
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Featured Product
Onward Robotics - Meet Me Fulfillment Automation
Meet Me uniquely brings talent and technology together: providing end-to-end process efficiency and enabling accurate and continuous fulfillment workflows. Proprietary Pyxis technology uniquely orchestrates picker and Lumabot AMR workflows independently, delivering fast, accurate, and efficient fulfillment from induction to pack out. Learn more about Meet Me Automation: Download Overview Brochure
Robotics and Automation - Featured Company
Zimmer Group US, Inc.
Are you interested in premium products in the fields of mechanical and plant engineering? Do you want to learn more about our solutions in the fields of automation, damping, linear, processing, tooling, and machine tooling technology?
