2D cameras for positioning and inspecting ultra-fine wires in semiconductor production
Wire bonding is a key process in semiconductor production. Extremely fine wires with diameters of 15 to 75 micrometers are used to create tiny electrical connections between a semiconductor chip and other components.
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High Performance Servo Drives for localized and distributed control applications from Servo2Go.com
Engineered to drive brushless and brush servomotors in torque, velocity or position mode, Servo2Go.com offers a broad selection of servo drives in a wide range of input voltages and output power levels.
