FABTECH - Balluff Experts Discuss Quality Management for Press Shops at FABTECH 2015
Dave Bird and Will Healy III of Balluff, Inc. will be presenting on the topic of Quality Management for Press Shops at the 2015 FABTECH event in Chicago, Illinois.
Florence, KY November 04, 2015 -- Balluff error proofing and stamping experts, Dave Bird and Will Healy III will be presenting on the topic of Quality Management for Press Shops: In-Die Process Validation & Post-Stamping Check Stations on Tuesday November 10th at 1:30pm in room S405B at McCormick Place at the 2015 FABTECH Show.
Session Overview:
Quality Management for Press Shops: In-Die Process Validation, Post-Stamping Check Stations & Error: For management, quality engineers and supervisors in stamping operations, part quality can be a source of frustration. Teams need to identify quality issues early and adjust quickly so they can have zero defects shipped to customer. This is readily accomplished through in-die process validation, electronic measurement and part tracking. Through real world examples we will discuss how press shops are successfully implementing 100% inspection of finished parts regardless of automation level.
FABTECH 2015, North Americas largest collaboration of technology, equipment and knowledge in the metal forming, fabricating, welding and finishing industries, will offer more than 100 education sessions at this years event. The targeted, technical, operational and managerial discussions are designed to help attendees gain knowledge from industry leaders and explore the latest technology and industry advancements. More than 40,000 manufacturing professionals are expected to attend the four-day event, Nov. 9-12 at Chicagos McCormick Place.
Visit Balluff at FABTECH in booth# S4167 and see press shop and stamping applications with RFID, sensors and non-contact coupling, along with automated welding solutions.
Learn more about Balluff at http://www.balluff.us
Learn more about the 2015 FABTECH event and see a complete listing of educational sessions at: http://www.fabtechexpo.com
Featured Product
Helios™2 Ray Time-of-Flight Camera Designed for Unmatched Performance in Outdoor Lighting Conditions
The Helios2 Ray camera is powered by Sony's DepthSense IMX556PLR ToF image sensor and is specifically engineered for exceptional performance in challenging outdoor lighting environments. Equipped with 940nm VCSEL laser diodes, the Helios2 Ray generates real-time 3D point clouds, even in direct sunlight, making it suitable for a wide range of outdoor applications. The Helios2 Ray offers the same IP67 and Factory Tough™ design as the standard Helios2 camera featuring a 640 x 480 depth resolution at distances of up to 8.3 meters and a frame rate of 30 fps.