New TI MCUs enable edge AI and industry-leading real-time control to advance system efficiency, safety and sustainability
The new TMS320F28P55x series of C2000™ MCUs with an integrated edge artificial intelligence (AI) hardware accelerator enables smarter real-time control, with up to 99% fault detection accuracy.
Six Predictions for the Future of IoT and Mobile App Integration
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IoT and mobile app development are two such prospects that industry analysts believe can reshape our lives in significant ways. Collectively, these technologies are expected to dominate the future and bring a never-seen change in enterprises across the niches.
Robot HMI for Projects Automation
To customize a robot interface, the only thing required is the robot HMI. However, there is a wide array of HMIs that differ from each other based on several factors. The challenge is to determine which is the best HMI.
Development of Battery-Free Multi-Rotation Absolute Encoder
In recent years, there have been many demands for equipment with high productivity to have a system that retains positioning information, even after the main power supply is turned off.
The Tiny Radar Chip Revolutionizing Gesture Recognition: Google ATAP's Project Soli
From All About Circuits: Google ATAP is bringing touchless interfaces to the market using a miniaturized radar chip no bigger than a dime. This is Project Soli.
Soli’s radar sensor is a marvel in many respects. For one thing, it solves a long-lived issue when it comes to gesture-recognition technology. Previous forays into the topic yielded almost-answers such as stereo cameras (which have difficulty understanding the overlap of fingers, e.g.) and capacitive touch sensing(which struggles to interpret motion in a 3D context).
Google ATAP’s answer is radar.
Radar is capable of interpreting objects’ position and motion even through other objects, making it perfect for developing a sensor that can be embedded in different kinds of devices like smartphones... (full article)
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Featured Product
3D Vision: Ensenso B now also available as a mono version!
This compact 3D camera series combines a very short working distance, a large field of view and a high depth of field - perfect for bin picking applications. With its ability to capture multiple objects over a large area, it can help robots empty containers more efficiently. Now available from IDS Imaging Development Systems. In the color version of the Ensenso B, the stereo system is equipped with two RGB image sensors. This saves additional sensors and reduces installation space and hardware costs. Now, you can also choose your model to be equipped with two 5 MP mono sensors, achieving impressively high spatial precision. With enhanced sharpness and accuracy, you can tackle applications where absolute precision is essential. The great strength of the Ensenso B lies in the very precise detection of objects at close range. It offers a wide field of view and an impressively high depth of field. This means that the area in which an object is in focus is unusually large. At a distance of 30 centimetres between the camera and the object, the Z-accuracy is approx. 0.1 millimetres. The maximum working distance is 2 meters. This 3D camera series complies with protection class IP65/67 and is ideal for use in industrial environments.
